Comparison of photon shutter temperature measured in the front end of insertion devices at SSRF with the FEA simulation results

WANG Naxiu1 LIU Shilei1; 2 XU Zhongmin1 ZHANG Min1 WU Guanyuan1 1

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Comparison of photon shutter temperature measured in the front end of insertion devices at SSRF with the FEA simulation results

更新时间：2021-03-05

- Comparison of photon shutter temperature measured in the front end of insertion devices at SSRF with the FEA simulation results
- NUCLEAR TECHNIQUES Vol. 34, Issue 3, (2011)
- 作者机构：
  
  1. 中国科学院上海应用物理研究所
  2. 中国科学院研究生院
- 作者简介：
- 基金信息：
- DOI：
  CLC： TL544
- Published：01 March 2011
- 稿件说明：
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[1]王纳秀,刘石磊,徐中民,张敏,吴冠原.SSRF活动光子挡光器的模拟与实验结果比较[J].核技术,2011,34(03):165-168.

WANG Naxiu1 LIU Shilei1, 2 XU Zhongmin1 ZHANG Min1 WU Guanyuan1 1. Comparison of photon shutter temperature measured in the front end of insertion devices at SSRF with the FEA simulation results[J]. Nuclear techniques, 2011, 34(3): 165-168.
[1]王纳秀,刘石磊,徐中民,张敏,吴冠原.SSRF活动光子挡光器的模拟与实验结果比较[J].核技术,2011,34(03):165-168. DOI：

WANG Naxiu1 LIU Shilei1, 2 XU Zhongmin1 ZHANG Min1 WU Guanyuan1 1. Comparison of photon shutter temperature measured in the front end of insertion devices at SSRF with the FEA simulation results[J]. Nuclear techniques, 2011, 34(3): 165-168. DOI：

摘要

介绍了上海光源插入件光束线前端区高热负载元件活动光子挡光器热缓释设计的数值模拟和实验结果。数值模拟与实验测量结果在10℃的误差范围内一致

且数值模拟结果都高于测量值。测量结果证明了挡光器热缓释设计中采用的数值模拟方法在直接冷却高热负载部件的应用中的可靠性和安全性。

Abstract

In this paper

we report our work to handle with the heat load of photon shutter in front ends of the Phase I beamlines at Shanghai Synchrotron Radiation Facility(SSRF).The heat load had been simulated with the ANSYS FEA software in designing the beamlines.Efforts were made recently to measure temperature of the photon shutters.The FEA and experimental results were compared.The simulated results agree with the measurement data within an error range of 10°C

with the FEA value being always larger than the measured ones.This indicates that the water-cooling design method of photon shutter is correct and the simulation of high heat load components cooled directly by water can ensure safety of the device.

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